发明名称 RESIN BONDED GRINDING WHEEL
摘要 PROBLEM TO BE SOLVED: To increase the strength of a resin binder phase and bending strength. SOLUTION: A roughly spherical phenol formaldehyde resin phase 5 with grain size of 5 to 50μm is dispersively arranged in the resin binder phase 3 consisting of phenol resin in addition to ultra abrasive grain 4, and the abrasive grain layer 2 of a resin bonded grinding wheel 1 is manufactured. The phenol formaldehyde resin plays a part as a reinforced phase because of high bending strength.
申请公布号 JP2001198836(A) 申请公布日期 2001.07.24
申请号 JP20000010684 申请日期 2000.01.19
申请人 MITSUBISHI MATERIALS CORP 发明人 NAKAMURA MASATO;TAKAHASHI TSUTOMU
分类号 B24D3/28;B24D3/02;(IPC1-7):B24D3/28 主分类号 B24D3/28
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