In-wafer testing of DFB semiconductor lasers

摘要

A method of manufacturing and testing a laser device that facilitates in-wafer testing of the laser device includes forming the laser device on a wafer and forming a light detecting device on the wafer adjacent to the laser device. The laser device should include a grating. The method further includes causing the laser device to lase while in the wafer and detecting light generated from the laser device with the light detecting device. Finally, the method includes obtaining an electro-optic parameter of the laser device from the detected light.