发明名称 |
Device and method for planarizing a thin film |
摘要 |
A device and method for planarizing a film layer device on a silicon wafer. The device has a circular track whose surface faces the track center, a carrier capable of moving along the track and carrying wafers around with their front surfaces facing the center, and a set of heating elements for heating the film layers on the wafers to make them fluid. Utilizing the centrifugal force on the film layer generated by the circular movement and the fluidity of the film layer provided by heating, planarization of the film layer is achieved.
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申请公布号 |
US6263586(B1) |
申请公布日期 |
2001.07.24 |
申请号 |
US19990350964 |
申请日期 |
1999.07.09 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LINLIU KUNG |
分类号 |
H01L21/00;(IPC1-7):F26B5/08 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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