| 摘要 |
A method is described for producing a microstructured surface relief by applying to a substrate a coating composition which is thixotropic or which acquires thixotropic properties by pretreatment on the substrate, embossing the surface relief into the applied thixotropic coating composition with an embossing device, and curing the coating composition following removal of the embossing device. The substrates obtainable by this method, provided with a microstructured surface relief, are particularly suitable for optical, electronic, micromechanical and/or dirt repellency applications. |
