| 发明名称 |
Chip that comprises an active agent and an integrated heating element |
| 摘要 |
Active compound chip and process for the production of an active compound chip comprising an active compound which is bound at room temperature, at least one heating element being located at least partly in the interior of the chip and the heating element having an electrical resistance and at least two electrical contacts. |
| 申请公布号 |
AU3539001(A) |
申请公布日期 |
2001.07.24 |
| 申请号 |
AU20010035390 |
申请日期 |
2001.01.03 |
| 申请人 |
BAYER AKTIENGESELLSCHAFT |
发明人 |
HERMANN NEUMANN;DIETMAR KALDER;HEINRICH W. STEINEL |
| 分类号 |
A01M1/20;A01N25/18;A01N37/10;A01N53/02;A01N53/06;A61L9/01;A61L9/03 |
主分类号 |
A01M1/20 |
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