发明名称 DIPPING DEVICE
摘要 PROBLEM TO BE SOLVED: To make a dipping device compact. SOLUTION: Plural treating vessels for dipping or the like are arranged in series in contact with each other and a conveyer 2 is arranged linearly in the same plane thereabove. A work piece 1 is tact-transported in floor conveyer attitude on the conveyer 2, stopped at every treating vessels for dipping or the like, horizontally rotated at about 180 deg. to be changed to overhead conveyer attitude to be dipped ire the corresponding treating vessel for dipping or the like to perform the dipping.
申请公布号 JP2001198508(A) 申请公布日期 2001.07.24
申请号 JP20000007055 申请日期 2000.01.14
申请人 HONDA MOTOR CO LTD 发明人 NISHIDA HIDENOBU
分类号 B05C3/09;B05C13/02;B65G49/04;C25D13/00;(IPC1-7):B05C3/09 主分类号 B05C3/09
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