| 摘要 |
A semiconductor device with a multi-level interconnection structure has a first conductive layer disposed below a fuse, and formed in the same layer as the first metal wire as a component of multi-level interconnects, and a second conductive layer disposed below the fuse and formed in the same layer as the second metal wire as a component of the multi-level interconnects. A laser beam control unit is configured with the first and second conductive layers. Thus, damage occurrence in a semiconductor substrate may be controlled during blowing the fuse, a quality deterioration and further a defective of the semiconductor device may be not only avoided, but also an integration degree thereof may be enhanced.
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