发明名称 LEAD-FREE GLASS AND COMPOSITION FOR SEALING
摘要 PROBLEM TO BE SOLVED: To obtain glass which contains no lead component so as to reduce load of environment, is usable at a sufficiently low temperature to seal and coat an electronic part and stands a practical use. SOLUTION: This lead-free glass has a composition comprising 5.1-60 mol% calculated as CuO of copper, 25-75 mol% P2O5 and 1-60 mol% RO (RO is one or more kinds selected from the group consisting of ZnO, BaO, CaO, MgO, SrO, SnO, NiO, FeO and MnO) based on oxide.
申请公布号 JP2001199740(A) 申请公布日期 2001.07.24
申请号 JP20000008135 申请日期 2000.01.17
申请人 MATSUSHITA KAZUMASA;ASAHI TECHNO GLASS CORP 发明人 MATSUSHITA KAZUMASA;KOIDE MANABU;TOSHIMA JUN;HIROI ATSUO
分类号 C03C8/24;C03C8/08;(IPC1-7):C03C8/24 主分类号 C03C8/24
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