| 摘要 |
PURPOSE: A BGA(Ball Grid Array) semiconductor package and a manufacturing method of the same are provided to be capable of enhancing the reliability of a solder joint by forming a flexible element absorbing heat cyclic stress applied to the solder joint formed between the BAG and a PCB. CONSTITUTION: A chip pad(102) on a semiconductor chip(100) is exposed between insulating films(104) of polymer. A flexible element(110) consisting of upper/lower substrates(106,108) is bonded on the insulating film(104) by adhesive(125). Metal powder(112) is filled in a groove of the flexible element(110). Metal patterns are formed on the flexible element(110), and are electrically connected to the chip pad(102) through metal wires(114), which are encapsulated by encapsulant(116). A solder resist film(118) is formed on the metal patterns while exposing metal patterns of predetermined area, and solder balls(120) are attached to the exposed metal patterns. |
