SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING IT

摘要

PURPOSE: To provide a wafer level semiconductor device of the structure in which the wafer level semiconductor device is not warped after the device is resin-sealed and then removed from a mold and a method for processing the wafer level semiconductor device in a state in which a wafer is not warped. CONSTITUTION: The wafer level semiconductor device comprises a wafer having a plurality of semiconductor elements formed on a surface, a sealing resin having a first part for sealing the surface of the wafer and a second part for sealing the side face of the wafer and having the same surface as a rear surface of the wafer, and a film covering the rear surface of the wafer and the second part of the sealing resin. The device is processed by using the wafer level semiconductor device in which this film is laminated.