发明名称 |
LEAD FRAME HAVING CONDUCTIVE LAYER |
摘要 |
PURPOSE: A lead frame having a conductive layer is provided to improve not only the mechanical characteristics but also the thermal characteristics of the lead frame. CONSTITUTION: The lead frame includes internal leads(110), outer leads(120), and a conductive layer(134). The outer leads are formed inside of the internal leads as a whole. The leads are formed of ironic alloys. The conductive layer is formed into a predetermined depth from the surface of the leads to improve the electrical characteristics of the leads. The predetermined depth is a surface depth(t) applied for a surface effect of high frequency transmission. The surface of the conductive layer is treated by a surface-treatment with de-oxidation chemicals.
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申请公布号 |
KR20010068780(A) |
申请公布日期 |
2001.07.23 |
申请号 |
KR20000000885 |
申请日期 |
2000.01.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JANG, GYEONG RAE |
分类号 |
H01L23/48;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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