发明名称 LEAD FRAME HAVING CONDUCTIVE LAYER
摘要 PURPOSE: A lead frame having a conductive layer is provided to improve not only the mechanical characteristics but also the thermal characteristics of the lead frame. CONSTITUTION: The lead frame includes internal leads(110), outer leads(120), and a conductive layer(134). The outer leads are formed inside of the internal leads as a whole. The leads are formed of ironic alloys. The conductive layer is formed into a predetermined depth from the surface of the leads to improve the electrical characteristics of the leads. The predetermined depth is a surface depth(t) applied for a surface effect of high frequency transmission. The surface of the conductive layer is treated by a surface-treatment with de-oxidation chemicals.
申请公布号 KR20010068780(A) 申请公布日期 2001.07.23
申请号 KR20000000885 申请日期 2000.01.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JANG, GYEONG RAE
分类号 H01L23/48;(IPC1-7):H01L23/48 主分类号 H01L23/48
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