WAFER LEVEL PACKAGE

摘要

PURPOSE: A wafer level package is provided to reduce a pitch between external connection terminals by using a conductive pillar instead of an existing solder ball. CONSTITUTION: A bond pad(11) is formed on a surface of a semiconductor chip. A pattern film is adhered on a surface of the semiconductor chip in order to expose the bond pad(11). A metal pattern(23) is arranged on a surface of the pattern film. A metal wire(30) connects one part of the metal pattern(23) of the pattern film with the bond pad(11). An encapsulant(40) encapsulates a wire bonding region corresponding to the metal wire(30). A conductive pillar(50) is formed on the other part of the metal pattern(23) of the pattern film.