| 摘要 |
PURPOSE: To reduce the polishing rate of a semiconductor substrate and the in-plane variation thereof polished by the same polishing cloth. CONSTITUTION: A polishing apparatus comprise a polishing cloth 19, a polishing board 17 with this cloth mounted on the surface, means 27 for feeding a dressing liq. such as hydrofluoric acid for dissolving abrasive grains to the polishing cloth, a brush 22 for brushing this cloth, and means 28 for feeding water to this cloth. It is capable of detecting the dressing liq. contained in the drained water by a sensor 34. The cloth 19 frayed due to polishing of plural semiconductor substrates by using this apparatus is dressed by the dressing liq. During this dressing, it can be brushed by the brush and dressed with water in a poststep. |
