| 摘要 |
PURPOSE: An exposure system using a multi-alignment method is provided to expose simultaneously a multitude of semiconductor wafer by using one light source. CONSTITUTION: Two or more wafer stages(102,104) shift a multitude of semiconductor wafer(106,108) toward an X-axis direction or a Y-axis direction, or a Z-axis direction. The semiconductor wafers(106,108) formed with photoresist are loaded on the wafer stages(102,104). A light generation portion(110) generates the light to pattern the photoresist formed on the semiconductor wafers(106,108). Two light irradiation portions(136,138) are installed at a position corresponding to the semiconductor wafers(106,108) loaded on the wafer stages(102,104). The light irradiation portions(136,138) transmits or reflects the light generated from the light generation portion(110).
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