BOTH-SIDED PRIMARY POLISH WAFER CARRIER

摘要

PROBLEM TO BE SOLVED: To provide a both-sided primary polish wafer carrier capable of substantially enhancing the quality, yield and productivity of a semiconductor wafer having a mirror polished surface, by effectively suppressing production of deficiencies on its peripheral surface such as those caused by breaking and chipping and substantially improving its flatness even if both-sided mirror polish is applied. SOLUTION: This both-sided primary polish wafer carrier has a feature that a hole to set a semiconductor slice wafer to be polished by both sided mirror-polish is provided and a soft fiber is protrusively embedded in the inner peripheral surface of the hole.