发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent a thick gate oxide film from being damaged by a washing and hydrofluoric acid pretreatment process that is made before forming a thin gate oxide film. SOLUTION: A first thick gate oxide film is formed, and an insulation film with etching resistance for washing, hydrofluoric acid treatment that is made for forming a second thin gate oxide film is formed on the surface of the first gate oxide film. A resist is formed at a part where the thick gate insulation film is formed, and the first gate oxide film is etched with the resist as a mask. The resist is released, and a surface at a part where the thin gate insulation film is formed is subjected to washing, hydrofluoric acid treatment, thus forming a second thin gate oxide film.
申请公布号 JP2001196464(A) 申请公布日期 2001.07.19
申请号 JP20000007449 申请日期 2000.01.17
申请人 NEC CORP 发明人 HASEGAWA EIJI
分类号 H01L21/28;H01L21/306;H01L21/311;H01L21/314;H01L21/316;H01L21/318;H01L21/8234;H01L21/8238;H01L27/088;H01L29/51;(IPC1-7):H01L21/823 主分类号 H01L21/28
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