COOLING DEVICE OF HEATING PART AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a cooling device, which is capable of efficiently conducting heat released from a semiconductor package from a heat receiving part to a heat sink and is moreover reduced in thickness. SOLUTION: A cooling device 25 is equipped with a heat sink 27 possessed of a heat receiving part 50, which receives heat released from a semiconductor package 19 and a heat-dissipating part 51, thermally connected to the heat receiving part 50, and a fan unit 26 which sends cooling air to the heat- dissipating part 51 of the heat sink 27. The heat-dissipating part 51 is arranged two-dimensionally and does not overlap with the heat receiving part 50 at a position distant from the semiconductor package. The heat-receiving part 50 of the heat sink 27 is set movable to approach to or recede from the semiconductor package and is energized via a leaf spring 80 in a direction so as to approach the semiconductor package.