| 摘要 |
A lead frame is placed on a lower mold with its non-mounting surface facing upward. Unused portion of resin tape is supplied between the upper mold and the lower mold. The resin tape is sucked to the upper mold and preheated. A molten resin is poured into a cavity for curing with the upper and lower molds closed together. Thus, resin sealing is performed. In this method, the resin tape is kept in close contact with the non-mounting surface of the lead frame and held in a space of the lead frame for resin sealing, so that formation of a cured resin from the bottom surface of the package can be prevented.
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