| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip carrier for mounting opto-electric element, which can mount the electric elements with many input/output terminals at high speed, and to provide an opto-electric wiring board which can be mounted by a method similar to a conventional one. SOLUTION: A light emitting element is mounted on the chip carrier for mounting opto-electric element, which ahs an insulating substrate 1, a first optical wiring layer 4 which is installed on an insulating substrate and has a core 2 transmitting light and a clad 3 where the core is buried, a fist metallic pad 6 which is electrically connected to the electric element on a face opposite to the insulating substrate, a second metallic pad 8 which is electrically connected to an optical element on the surface of a first optical wiring layer, a third metallic pad 7 which is electrically connected to an outer substrate in a face similar to the second metallic pad, electric wiring which is positioned on the surface or the inner part of the insulating substrate or in the first optical wiring layer and connects the first metallic pad and the second metallic pad and a mirror 9 arranged in a part of the optical wiring. The carrier is electrically connected to the opto-electric wiring substrate.</p> |
