| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device. SOLUTION: Sealing resin of a semiconductor chip is dripped above except above other components by such as amount as a conductive adhesive matter used for connection of other components is not covered completely. Since the conductive adhesive matter of other components does not break through the sealing resin during subsequent heating, adverse effect on the oscillation frequency of a quartz oscillator can be eliminated.
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