| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a pick-up device capable of automatically regulating and setting a pick-up height without effecting an influence of a thickness of a work such as a semiconductor chip, a liquid crystal panel or the like or a tape and rapidly and accurately moving in a section. SOLUTION: The pick-up head 10 roughly comprises a base member 11 mounted at a leading end of a support member extended from a Y-axis-to-Z-axis moving mechanism, a chuck collet 12 for chucking and holding the chip, a shaft 13 having the collet 12 provided at one end and independently vertically movably mounted at the member 11, a proximity sensor 14 provided at a predetermined position of the member 11 to detect a sensor plate 15 provided at the other end side of the shaft 13 and to detect the contact state of the collet 12 with the chip CP, and a pressure reducing mechanism 16 for reducing the atmospheric pressure of the chuck surface 12a of the collet 12.</p> |
