发明名称 HEAT SINK AND METHOD OF ITS MANUFACTURING AND COOLER USING IT
摘要 PROBLEM TO BE SOLVED: To provide a heat sink, a method of its manufacturing and a cooler employing it, in which the dissipation of the heat generated by a heatfull electronic component heat can be enhanced while reducing the size and weight. SOLUTION: The color comprises a heat transfer part contacting a heat generating body to be cooled, a heat dissipating part comprising fins bonded to the heat transfer part, and a cooling fan 4 disposed directly above the heat dissipating part wherein the heat transfer part of the heat sink comprises struts 2 of columnar structure in order to enhance the effect for spreading heat generated from a heat generating body 3 and pin type fins 1 are arranged on the opposite sides of the struts 2 other than the heat receiving face.
申请公布号 JP2001196511(A) 申请公布日期 2001.07.19
申请号 JP20000005533 申请日期 2000.01.14
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SATO IKU;FUJIWARA YASUHIRO;MANABE HARUJI;UEZURU SHINOBU
分类号 H01L23/36;F28F3/04;H01L21/48;H01L23/367;H01L23/467;(IPC1-7):H01L23/36 主分类号 H01L23/36
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