发明名称 |
HEAT SINK AND METHOD OF ITS MANUFACTURING AND COOLER USING IT |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink, a method of its manufacturing and a cooler employing it, in which the dissipation of the heat generated by a heatfull electronic component heat can be enhanced while reducing the size and weight. SOLUTION: The color comprises a heat transfer part contacting a heat generating body to be cooled, a heat dissipating part comprising fins bonded to the heat transfer part, and a cooling fan 4 disposed directly above the heat dissipating part wherein the heat transfer part of the heat sink comprises struts 2 of columnar structure in order to enhance the effect for spreading heat generated from a heat generating body 3 and pin type fins 1 are arranged on the opposite sides of the struts 2 other than the heat receiving face. |
申请公布号 |
JP2001196511(A) |
申请公布日期 |
2001.07.19 |
申请号 |
JP20000005533 |
申请日期 |
2000.01.14 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SATO IKU;FUJIWARA YASUHIRO;MANABE HARUJI;UEZURU SHINOBU |
分类号 |
H01L23/36;F28F3/04;H01L21/48;H01L23/367;H01L23/467;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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