| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for manufacturing a semiconductor device with which positioning of latticed layers laminated is simplified in production of the semiconductor device having a crystal structure with three- dimensional periodic refractive index distribution using the precision laminating method by wafer melt sticking. SOLUTION: Two semiconductor wafers 101 and 102 to laminate and fusion bond are fixed to wafer holding tables 201 and 202, respectively, and are held integrally to a wafer holding part 2. Firstly, a lattice image by infrared light from an infrared light source 30 of an infrared optical system 3 to these semiconductor wafers 101 and 102 is detected by a detecting part 5, and a rough positioning is performed. Next, a precise positioning is enabled by detecting a diffraction figure by a laser beam from a laser light source 40 of a laser optical system 4 with the detecting part 5, and by performing a fine positioning, the positioning is simplified. |
