| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection structure which is capable of coping with the micronization of input/output connection pads and a reduction in pitch of the pads, and absorbing a heat distortion difference between a semiconductor element and a board in a mounting structure through which a semiconductor element is connected to a board. SOLUTION: A plate of Cu/Cu2O composite alloy which is excellent in fine processability, Young's modulus, and electric resistance is connected to the electrode pads of a board, fine columnar connections are formed corresponding to the electrode pads of a semiconductor element, and the electrode pads of the board are electrically connected to the electrode pads of the semiconductor element through the intermediary of the columnar connections. |
