| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-bare chip mounted body which can easily realize three-dimensional mounting of a semiconductor chip, and to provide a multi-chip package, a semiconductor device using the package and an electronic unit. SOLUTION: In the multi-bare chip mounted body, plural semiconductor chips are laminated. The plane of the chip 3A on an upper layer is shifted from the chip 3B on the lower layer and laminated. Chip terminals 4A are arranged at the edges of the chip on the common projecting face of the lower layer chip 3B. Plural semiconductor chips 14A, 14B and 14C in the same or different sizes are laminated, by arranging two adjacent sides 16X and 16Y. Terminals 18n common to the semiconductor chips 14 are connected on the sides of the arrayed edge sides 16X and 16Y. Then, terminals between laminated chips, which are intensively arranged, are conducted/connected at the end face of the laminated body. |
