发明名称 METHOD AND DEVICE FOR POLISHING WORK
摘要 PROBLEM TO BE SOLVED: To provide a method and device for polishing work by which the surfaces of works can be polished in such a way that the erosion of the surfaces by an abrasive solution can be prevented and the quantity of the cleaning solution used in a cleaning step can be reduced, and after polishing, pits are hardly formed on the surfaces and very few particles adhere to the surfaces, with the number of the particles hardly fluctuating, so that the particles may be removed efficiently in a short time. SOLUTION: In a method for polishing work in which a plurality of works is polished by causing relative motions between the works and polishing cloth while the abrasive solution is supplied to the cloth and the works are pressed against the cloth, a polished work is separated from the polishing cloth within 45 seconds by reducing the pressing force applied to the work to zero. At the time of simultaneously polishing the works, it is preferable to separate polished works from the polishing cloth by reducing the pressing forces applied to the works to zero while the polishing of the other works is continued and, whenever the works are polished, the polished works are successively separated from the polishing cloth by reducing the pressing forces applied to the works to zero.
申请公布号 JP2001196340(A) 申请公布日期 2001.07.19
申请号 JP20000325763 申请日期 2000.10.25
申请人 SHIN ETSU HANDOTAI CO LTD;NAGANO DENSHI KOGYO KK 发明人 KODAIRA MASAO;NAKAMURA MIKIO;KIDA TAKAHIRO
分类号 B24B37/10;H01L21/304 主分类号 B24B37/10
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