| 摘要 |
The present invention is drawn to a method of making solder bump interconnections or BGA ranging from chip-level connections to either single chip or multichip modules, flip-chip packages and printed circuit boards connections. According to the method of the present invention, a die wafer or a substrate with a conductive contact location is positioned in close proximity and aligned with a mold wafer having a pocket corresponding to the contact location of the die wafer. A source of a molten solder is also provided which interconnects with the mold wafer. The molten solder from the source is introduced into the pocket of the mold wafer such that the molten solder wets the contact location aligned with the pocket. Before the molten solder inside the pocket is allowed to solidify, the die wafer and the mold wafer are separated from each other. Some of the molten solder is attracted to the contact location of the die wafer and it separates from the remaining molten solder in the pocket so as to assume the shape of a partially sphere. The method of the present invention is especially useful for batch processing in the formation of a large number of solder balls.
|
