| 摘要 |
PROBLEM TO BE SOLVED: To provide a low chip type coil element wherein there are so eliminated the penetrating clearances of fluxes and fused solders even when it is mounted on a circuit pattern printed with a cream solder and is heated by passing it through a reflow furnace that its quality is stabilized and not deteriorated. SOLUTION: A low-elevation chip type coil element has a case core 40 having a bottomed unpierced recessed hole 41 and a coil 50, wherein a winding 52 is wound around a drum core 51 and a plurality of winding terminals 52a, 52b are derived from the winding 52. On the upper and lower surfaces orthogonal to the recessed hole 41 of the case core 40, there are provided respectively electrodes 43a, 44a and electrodes 43c, 44c for external connections which are extended continuously via electrodes 43b, 44b on both the opposite sidewalls of the case core 40. After inserting the coil 50 into the recessed hole 41, the winding terminals 52a, 52b are so interposed respectively between the electrodes 43a and a metallic fastening piece 60A and between the electrode 44a and a metallic fastening piece 60B as to subject them to heat fusions. Then, the top surfaces of both the case and drum cores 40, 51 and the metallic fastening pieces 60A, 60B are all coated with a coating material 70.
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