| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable a semiconductor substrate to be diced well with a blade fixing the substrate by a suction force induced through continuous pores provided to a porous sheet by a method wherein the semiconductor substrate is placed on a suction table through the intermediary of the porous sheet, and vacuum suction is generated by the suction table. SOLUTION: A semiconductor substrate 2 is placed on a suction table 1 through the intermediary of a porous sheet A, the suction table 1 is made to generate a suction force by vacuum, and the semiconductor substrate 2 is cut with a blade 3 as fixed by vacuum suction induced through the continuous pores of the porous sheet A, where a groove is provided in a part of the surface of the porous sheet A which is brought into contact with the semiconductor substrate 2, and the above part is located just under the cut point of the substrate 2.</p> |
