发明名称 |
DOPING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT AND MANUFACTURING APPARATUS THEREOF AND DOPING EQUIPMENT |
摘要 |
PROBLEM TO BE SOLVED: To realize an ideal impurity concentration profile by a method using a laser irradiation at the time of the treatment of a doping of an Si wafer with Si chips and activation and to provide a technique to form electrodes on the rear of the Si chip. SOLUTION: When electrodes are formed on the rear of an Si chip formed on an Si wafer 1, a doping of dopants 27 and 27a to 27c to the chip 1 and an activation of these dopants 27 and 27a to 27c are performed by a heating using each heating means in the same high-vacuum chambers 11 and 11a.
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申请公布号 |
JP2001196320(A) |
申请公布日期 |
2001.07.19 |
申请号 |
JP20000310154 |
申请日期 |
2000.10.11 |
申请人 |
TOSHIBA CORP |
发明人 |
OBARA TAKASHI;NOZAKI HIDEKI;KOBAYASHI MOTOOMI |
分类号 |
H01L21/22;H01L21/268;H01L21/336;H01L29/739;H01L29/78;(IPC1-7):H01L21/22 |
主分类号 |
H01L21/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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