| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite copper material excellent in plastic machining, a method of production, heat dissipation plate of a semiconductor device and a semiconductor device employing it. SOLUTION: The composite copper material comprises a metal and a granular or rod-like inorganic compound, and contains 10-55 vol.% of cuprous oxide (Cu2O) and the remainder of copper (Cu), and has coefficient of thermal expansion of 5×10-6-17×10-6/ deg.C and thermal conductivity of 100-380 W/m.k. It can be produced through a series of processes of melting, casting and machining and can be applied to the heat dissipation plate of a semiconductor device. |
