| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device having excellent heat dissipation characteristics and high mounting reliability. SOLUTION: The semiconductor device comprises a semiconductor element 2 flip chip mounted on a printed wiring board 1 with bumps 3, and a heat dissipating member, i.e., a heat spreader 7, bonded to the semiconductor element 2 through an adhesive layer 10 composing a ceramic plate having pores impregnated with thermosetting resin. |
