| 摘要 |
<p>An epoxy resin composition which comprises (A) an epoxy resin, (B) a compound having a phenolic hydroxyl group, (C) a bridged phenoxyphosphazene compound, and (D) a particulate inorganic filler, the amount of the ingredient (C) being 0.01 to 30 wt.% based on the total amount of the ingredients (A), (B), and (C) and the amount of the ingredient (D) being 60 to 98 wt.% based on the total amount of the ingredients (A), (B), (C), and (D). The epoxy resin composition and the molded object formed therefrom are halogen-free and antimony-free and have excellent flame retardancy. When this epoxy resin composition is used to encapsulate an electronic part element such as an LSI or VLSI, an electronic part excellent in various properties including heat resistance, moisture resistance, and high-temperature impact resistance is obtained.</p> |
