发明名称 SUBSTRATE TREATER
摘要 PROBLEM TO BE SOLVED: To provide a substrate treater of a structure that a reduction in a metal contamination, foreign matters and the like, which are generated from the space covered with a work coil cover provided in the treater, is made possible. SOLUTION: Semiconductor wafers 16 are mounted on a susceptor 15. Work coils 20 are provided under the lower side of the susceptor 15. A work coil cover 21 made of a quartz is placed on a base 13 in such a way as to cover the coils 20. A sealing part 27 is provided on the lower part of the inner peripheral part of the cover 21. A growth treating space 11 for performing an epitaxial growth on the wafers 16 and a work coil installation space 12 installed with the coils 20 are sealed with the cover 21 and the sealing part 27. The sealing part 27 is provided with a bellows 34 having flanges 33 and 35 on both ends of the bellows 34. O-rings 31 and 37 are respectively provided on the end surfaces of the flanges 33 and 35.
申请公布号 JP2001196315(A) 申请公布日期 2001.07.19
申请号 JP20000007742 申请日期 2000.01.17
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 SHIMA NOBUHITO;SANBE MAKOTO;TAKAMI SATORU;IKEDA FUMIHIDE;INOKUCHI YASUHIRO
分类号 H01L21/205;C23C16/44;(IPC1-7):H01L21/205 主分类号 H01L21/205
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