| 摘要 |
PROBLEM TO BE SOLVED: To form IC packages in the wafer state so as to provide the IC packages of the same size with an IC chip. SOLUTION: Bumps are bonded to electrode pads in a wafer state, then protective material is applied on a wafer, and the bumps are exposed. Thereafter, the wafer is cut off along scribe lines, and an IC package is completed. |
