发明名称 HEAT TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment apparatus in which a resist sublimate or the like is difficult to stay, that can prevent the temperature distribution of a treated substrate from becoming unstable, and that can control the temperature of the treated substrate with high accuracy. SOLUTION: This heat treatment apparatus is provided with a hot plate on or above which the treated substrate is loaded and that heats the treated substrate, a surrounding member provided so as to surround the heat treatment space in which the heat treatment substrate located above the hot plate is heat-treated, a sealing mechanism that almost seals the circumference of the surrounding member when the heat treatment space is surrounded by the surrounding member, and an air current forming means that forms an air current from the outside circumference toward the center in the heat treatment space.
申请公布号 JP2001196299(A) 申请公布日期 2001.07.19
申请号 JP20000318178 申请日期 2000.10.18
申请人 TOKYO ELECTRON LTD 发明人 SAKAMOTO TAKAHIRO;YAMAGUCHI TAKAMITSU;KUBO MASATO
分类号 G03F7/30;F27D7/06;F27D11/02;H01L21/027;H05K3/22;(IPC1-7):H01L21/027 主分类号 G03F7/30
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