| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively provide an electronic module superior in heat dissipation property. SOLUTION: In an electronic package, a circuit board for resin molding, where a lead frame is arranged on a metallic board through an insulating layer, the circuit board provided with a stepped part in the peripheral edge part of the face of a side where the lead frame of the metallic board is not disposed is used, preferably, and one transfer molding is conducted. |
