| 摘要 |
<p>A method of mounting a chip (1) connecting a bump (2) formed on the chip (1) to an electrode (6) formed on a substrate (5) and providing an underfill agent (7) between the chip (1) and the substrate (5), comprising the steps of applying the underfill agent (7) onto at least one of the substrate (5) and the chip (1), moving the chip (1) to the substrate (5) to bring the bump (2) in to contact with the electrode (6), expanding the underfill agent (7), in a space between the chip (1) and substrate (5), to around the bump (2) and electrode (6) in contact with each other, and heating the bump (2) or electrode (6) in the state that the bump (2) is buried in the underfill agent (7) to melt the bump (2) or the electrode (6) so as to weld the bump (2) to the electrode (6), whereby the secondary oxidation of the bump (2) to be heated for melting can be prevented without purging by nitrogen gas, and both a mounting device and mounting process can be simplified.</p> |
