发明名称 Field effect transistor device with trench-shaped gate electrode
摘要 The FET device includes a semiconductor substrate (1) with a trench (2). An insulating layer (4) covers the walls of the trench. A conductive material (5) fills the trench and forms a gate electrode. A source region (6), a body region (7) and a drain region (10) are also formed. A highly doped region (8) is formed in the body region that is at least partially arranged under the source region and adjoins the source region. The source region extends from the first surface (3) of the semiconductor substrate (1), along the trench (2) and up to the highly doped region in the body region.
申请公布号 DE10009345(C1) 申请公布日期 2001.07.19
申请号 DE20001009345 申请日期 2000.02.28
申请人 INFINEON TECHNOLOGIES AG 发明人 SCHAEFFER, CARSTEN;SCHAGERL, GUENTER;NEIDHART, THOMAS
分类号 H01L21/265;H01L21/331;H01L21/336;H01L29/08;H01L29/417;H01L29/423;H01L29/739;H01L29/78;(IPC1-7):H01L29/739 主分类号 H01L21/265
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