发明名称 METHOD OF BONDING SUBSTRATES
摘要 A substrate (58) is permanently bonded to a thermoplastic member (52) by applying a sufficient degree of heat and pressure. Thermoplastic is notoriously non-receptive to even the most aggressive adhesives. As such, it has been extremely difficult to attach non-plastic components to thermoplastic products. To avoid this problem, the thermoplastic product (52) is heated, on one side (54), to a temperature just below its melting point. A substrate (58), made of a material such as polyethylene, is placed against the non-heated side (56) of the thermoplastic (52). As heat passes through the thermoplastic, it heats and eventually melts a portion of the substrate (58). Ideally pressure is applied to force the melted material against the substrate. The materials are then allowed to cool and harden, thus forming a permanent bond between them. Additional materials (60) may be coupled to the substrate (58), as desired.
申请公布号 WO0151578(A1) 申请公布日期 2001.07.19
申请号 WO2001US00323 申请日期 2001.01.05
申请人 AMERICAN MEDICAL SYSTEMS, INC.;DEININGER, STEVEN, T. 发明人 DEININGER, STEVEN, T.
分类号 C09J5/06;(IPC1-7):C09J5/00;B32B31/14;B29D9/00 主分类号 C09J5/06
代理机构 代理人
主权项
地址