MULTILAYER WIRING BOARD, WIRING BOARD, METHOD OF FORMING MULTILAYER WIRING BOARD AND WIRING BOARD AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a multilayer wiring board where stress generated due to a difference in the thermal expansion coefficient of a semiconductor element to be mounted can be relaxed not on a semiconductor element-side but on a substrate-side, and to provide a wiring substrate, the manufacturing methods of the multilayer wiring board and the wiring board and a semiconductor device. SOLUTION: The wiring layer 203a of the uppermost layer where a plurality of thermal pads 203b are formed in accordance with the positions of a plurality of solder bumps 207 (outer connection terminals) provided for the semiconductor element 205 to be mounted, a metallic column 208 formed on the terminal pad 203b, a resin coat 206 formed by covering the side part of the metallic column and an insulating layer 210 formed on the wiring layer 203a of the uppermost layer so that a gap is generate with the outer peripheral face of the resin coat 206 are installed.