METHOD AND APPARATUS FOR HANDLING ALIGNED COMPONENTS

摘要

PROBLEM TO BE SOLVED: To provide a method and an apparatus for transferring aligned components capable of transferring the components by reducing the moving distance to a transfer destination and reversing the front and the rear of the component. SOLUTION: IC chips (aligned components) 2 aligned and disposed in perpendicular two directions from a wafer containing cassette 50 are transferred onto a tape 42 arranged above a component receiving unit 7 by the steps of drawing a carrier 6 for carrying the chips 2, holding the carrier 6 by the unit 7, moving the chips 2 to a pick-up position by X and Y direction transferring of the unit 7, sucking and holding the chips by a suction nozzle 3 of a transfer head 31, and moving the head 31. When the chips 2 are transferred through front and rear reversing means 71, the chips 2 can be transferred by directing the active surfaces of the chips 2 downward.