BARE CHIP MOUNTING METHOD AND ACTIVE MATRIX BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To realize a bare chip mounting method through which a bare chip can be mounted on a circuit board without making the total thickness of the circuit board mounted with a bare chip exceed that of the circuit board mounted with no bare chip and without deteriorating the board in strength. SOLUTION: A hole whose inner diameter is larger than the external dimension of a chip is bored in the surface of a board under a part of a wiring formed on the surface of the board, the chip is laid in the hole, and the electrodes of the chip are connected to the corresponding wirings of the board. The board mounted with no bare chip is kept unchanged in thickness even after it is mounted with a bare chip.