| 摘要 |
<p>A method for producing, efficiently at low cost, a chip-size package in which conductor wiring is provided on the surface where an electrode of a semiconductor chip is formed and an enlarged electrode pin is provided, especially a method for easily fabricating wiring and a bump. A method for fabricating a conductor wiring circuit on a semiconductor comprisies the steps of forming a wiring-forming metallic foil on the surface of the semiconductor where an electrode is formed, forming a resist wiring pattern by photo-etching the metallic foil, etching the metallic foil, and dividing the semiconductor into individual devices. A semiconductor device produced by such a method is also disclosed.</p> |
