发明名称 Bohrdecklage aus oder im wesentlichen aus einer Metallfolie
摘要 The invention relates to a drilling covering (2), made from, or essentially made from a metal foil (8), for the mechanical drilling of microfine holes, in particular, in the production of circuit boards, which is characterised in that the metal foil comprises, on at least one outer facing surface, an essentially non-directional microtopography (10), with a surface roughness (16) of between 1 and 5 mu m, preferably between 2 and 4 mu m and a target value of 3 mu m. Said microtopography permits an off-centre deviation of drilling by, at most, an amount corresponding to the order of magnitude of the surface roughness. The above may be produced by means of rolling, stamping, sandblasting, microetching, electropolishing or similar. Where desired the metal foil (8) can be laminated on a film (20) made from softer material.
申请公布号 DE19963452(A1) 申请公布日期 2001.07.19
申请号 DE19991063452 申请日期 1999.12.28
申请人 CIMATEC GMBH PRODUKTE FUER LEITERPLATTEN 发明人 FREUND, REINHARD
分类号 B23B35/00;B23B41/14;H05K3/00;(IPC1-7):B23B49/00 主分类号 B23B35/00
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