| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board for BGA-type semiconductor plastic package, which is very thin, superior in rigidity, and superior in heat resistance, electric insulating property after moisture absorption and migration resistance. SOLUTION: A circuit board is generated by using a glass fabric base material one side copper clad laminating board. A bonding terminal part and a ball pad part are generated in copper foil, a via hole is made from the insulating layer on an upper face so that it reaches the rear face of copper foil at a lower face and a printed wiring board is obtained. Two or above glass woven fabric whose thickness is 50±10 μm, whose weight is 35 μ to 60 g/m2 and whose permeability is not more than 25 cm3/cm2 sec are favorably used and inorganic filler is added. Thus, polyfunctional compound ester cyanate resin compound is used as resin. Thus, the new printed wiring board which is superior in workability at the time of making the printed wiring board since it has high regidity, whose ball sharing intensity is satisfactory, is superior in heat resistance, electric insulating property and migration resistance after pressure cooker processing and which is superior in mass production can be obtained. |
