发明名称 |
CONTACT PROBE |
摘要 |
<p>PROBLEM TO BE SOLVED: To restrain the degradation of signal property and electric resistance. SOLUTION: In a contact probe 20, a contact pin 2ag and a metal film layer 6 to form a ground layer of a film 4 among protruding contact pins 2a from the film 4 are connected by a ribbon-formed bonding member 21. The ribbon- formed bonding member 21 is installed at the outside of the film 4.</p> |
申请公布号 |
JP2001196114(A) |
申请公布日期 |
2001.07.19 |
申请号 |
JP20000004932 |
申请日期 |
2000.01.13 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
SUETSUGU TAKUZO;IWAMOTO TAKAFUMI;ASO TAKESHI |
分类号 |
H01R4/58;(IPC1-7):H01R12/32 |
主分类号 |
H01R4/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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