| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be made usable through a contain operation, without having to reject the whole semiconductor device, even when a semiconductor chip is defective. SOLUTION: A BGA substrate 1, a normal chips 2 which is a semiconductor chip and connected to the BGA substrate 1, and preliminary pads 20 for newly loading reserve chips when the normal chips 2 is defective, are installed. Chip switch wiring 11 for changing over the normal chip 2 to the reserve chip is preferably installed. Since a dam 12 separates the reserve pads 20 and the normal chips 2, an underfill 4 is prevented from flowing to a reserve pad 20-side, when filling a liquid underfill 4 between the normal chip 2 and the BGA substrate 1.
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