发明名称 CONDUCTIVE PARTICLE FOR ANISOTROPIC CONDUCTIVE CONNECTION AND ANISOTROPIC CONDUCTIVE CONNECTION MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a conductive particle which improves a defect of conductive particle for anisotropic conductive connection covered with conventional thermoplastic resin or conventional thermosetting resin, even though the surface is covered with insulation resin. SOLUTION: In a conductive particle for anisotropic conductive connection consisted of conductive particle 1 and an insulation resin layer 2 covering a surface of the conductive particle, the insulation resin layer 2 is formed of insulation gel state resin whose gel fraction is 90% or more.
申请公布号 JP2001195921(A) 申请公布日期 2001.07.19
申请号 JP20000178408 申请日期 2000.06.14
申请人 SONY CHEM CORP 发明人 YAMADA YUKIO;MATSUMOTO TOSHIYUKI
分类号 H01R11/01;B03C5/02;C08K9/08;H01B1/20;H01B1/22;H01B5/00;H01B5/16;H01B13/00;H01L21/60;H01L23/482;H01L23/498;H01R4/04;H01R13/03;H05K3/32;(IPC1-7):H01B5/00 主分类号 H01R11/01
代理机构 代理人
主权项
地址