发明名称 |
CONDUCTIVE PARTICLE FOR ANISOTROPIC CONDUCTIVE CONNECTION AND ANISOTROPIC CONDUCTIVE CONNECTION MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive particle which improves a defect of conductive particle for anisotropic conductive connection covered with conventional thermoplastic resin or conventional thermosetting resin, even though the surface is covered with insulation resin. SOLUTION: In a conductive particle for anisotropic conductive connection consisted of conductive particle 1 and an insulation resin layer 2 covering a surface of the conductive particle, the insulation resin layer 2 is formed of insulation gel state resin whose gel fraction is 90% or more. |
申请公布号 |
JP2001195921(A) |
申请公布日期 |
2001.07.19 |
申请号 |
JP20000178408 |
申请日期 |
2000.06.14 |
申请人 |
SONY CHEM CORP |
发明人 |
YAMADA YUKIO;MATSUMOTO TOSHIYUKI |
分类号 |
H01R11/01;B03C5/02;C08K9/08;H01B1/20;H01B1/22;H01B5/00;H01B5/16;H01B13/00;H01L21/60;H01L23/482;H01L23/498;H01R4/04;H01R13/03;H05K3/32;(IPC1-7):H01B5/00 |
主分类号 |
H01R11/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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