| 摘要 |
PROBLEM TO BE SOLVED: To rework an electronic component without oxidizing a printed board by soldering the electronic component, without having to use reflow furnace. SOLUTION: Outside of a nozzle 10 for jetting inert gas G is covered with covers 18, 20, and the forward edge of the cover is brought into tight contact with a substrate 40 to form an inert gas atmosphere around a work 30. Inert gas, having a temperature for melting a solder 31 and a pressure for floating the work from the substrate, is fed between the work and the substrate thus soldering the work on the substrate or removing the work therefrom.
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